[Show Name] SMTCONNECT 2019 – International Exhibition and Conference for System Integration in Micro Electronics
[Dates] May 7(Tue)-9(Thu), 2019 09:00 – 17:00
[Venue] Messezentrum Nuernberg
[Organiser] Mesago Messe Frankfurt GmbH
[PARMI GERMANY Booth Number] 4325
PARMI Co.,Ltd. is going to participate in the ‘SMT Hybrid Packaging 2019 ’, one of the leading international exhibitions for system integration in micro electronics.
In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor) and Xceed BSI(3D AOI for Bottom Side Inspection), PCI 100(2D/3D conformal coating inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.
PARMI’s booth will be located at 4325.