PARMI

[vol.22] November 2022

SPI-AOI Linkage Analysis  Determining the root cause of a defect which occurred during the manufacturing process, is critical to prevent recurrence of the defect. PARMI’s SigmaX SPI and Xceed AOI inspection systems obtain the whole image of the PCB and the defect data. Data accumulated through this process allows tracing which process is causing the …

[vol.22] November 2022 Weiterlesen »

[vol.21] October 2022

Foreign Materials/Surface Contamination Inspection of PCB Assemblies 1. Foreign Materials/Surface Contamination  Foreign materials or scratches during the manufacturing process contaminate the PCB surface and can cause various issues. Such issues include pattern defects, pinholes, and electrical malfunction, which reduces product reliability and yield. Therefore, it is essential to minimize the particles and contamination on the …

[vol.21] October 2022 Weiterlesen »

[vol.20] September 2022

LED Distance Measurement 1. LED Distance Measurement  If a manufacturer pursues only a high amount of light without considering the light distribution pattern of vehicle headlights, it may cause problems with glare to the driver in the opposite lane and cause an accident. In order to ensure the safety of the driver, for automotive headlights, …

[vol.20] September 2022 Weiterlesen »

[vol.19] August 2022

  PARMI Partners with Mactech PARMI, a global leader in the PCB inspection machine sector, has partnered with Mactech to support customers in Argentina. Mactech (formerly under the name Macon) is an established and well respected distributor of SMT equipment based in Buenos Aires and Rio Grande, Argentina. With over 40 years of experience and …

[vol.19] August 2022 Weiterlesen »

[vol.18] July 2022

PARMI MES  Production environments require increasing levels of automation, standardization, and efficiency, and related technologies are fast evolving. The MES (Manufacturing Execution System) is one of the solutions to these needs. Data analytics/management capabilities of MES provide detailed information about the manufacturing environment, which can help management make faster decisions.  PARMI MES is a system …

[vol.18] July 2022 Weiterlesen »

PARMI Café Grand Open

PARMI will be opening an in-house café in our headquarters to improve the welfare of our employees and to facilitate the convenience of our customers. The in-house café will be utilized as a space for community centers and in-house events that reflect an open corporate culture. Luxurious yet vintage wood interiors and plants provide a …

PARMI Café Grand Open Weiterlesen »

[vol.17] June 2022

Solder Ball Inspection 1. Solder Ball Application Description  Solder ball is a spherical solder that electrically connects between the chip package and the PCB, and is used in the semiconductor packaging process to precisely control the amount of solder. The solder ball has advantages such as superior electrical conductivity compared to the traditional solder application …

[vol.17] June 2022 Weiterlesen »

[vol.16] May 2022

  Printer Doctor 1. Real Time Printing Process Optimization PARMI 3D SPI SigmaX features a printer setup troubleshooting tool called the Printer Doctor. This program immediately analyzes the solder print quality and provides condition data of squeegee, stencil, board, etc. In the case of defects, it then provides the operator with the potential issue and …

[vol.16] May 2022 Weiterlesen »

PARMI to Exhibit at SMT CONNECT 2022

[Show Name] SMT CONNECT 2022 [Dates] May 10(Tue)-12(Thu), 2022 09:00–17:00 [Venue] NürnbergMesse, Germany [Organizer] Mesago Messe Frankfurt GmbH [Booth Number] Hall 4, Stand 107 PARMI is going to participate in the ‘SMT CONNECT 2022’, Europe’s leading exhibition on solutions for electronic assemblies and systems. In order to show the reliability and accuracy of the machine, PARMI will exhibit …

PARMI to Exhibit at SMT CONNECT 2022 Weiterlesen »

[vol.15] April 2022

Underfill Inspection 1. Underfill Inspection Underfill is a method of completely filling the bottom of the package with epoxy in the packaging process, to be more resistant to environmental factors such as moisture, temperature variations, and mechanical shock. If the underfill process is defective, it can result in reduced reliability of the end product. Therefore, …

[vol.15] April 2022 Weiterlesen »