Newsletter

[vol.16] May 2022

  Printer Doctor 1. Real Time Printing Process Optimization PARMI 3D SPI SigmaX features a printer setup troubleshooting tool called the Printer Doctor. This program immediately analyzes the solder print quality and provides condition data of squeegee, stencil, board, etc. In the case of defects, it then provides the operator with the potential issue and …

[vol.16] May 2022 Weiterlesen »

[vol.15] April 2022

Underfill Inspection 1. Underfill Inspection Underfill is a method of completely filling the bottom of the package with epoxy in the packaging process, to be more resistant to environmental factors such as moisture, temperature variations, and mechanical shock. If the underfill process is defective, it can result in reduced reliability of the end product. Therefore, …

[vol.15] April 2022 Weiterlesen »

[vol.14] January 2022

  Bottom Side Inspection 1. Xceed BSI Xceed BSI (Bottom Side Inspection) is a 2D & 3D AOI machine that inspects the bottom side of the PCB without flipping the board after wave or selective soldering. Since it is not necessary to flip the PCB, it eliminates unnecessary handling of the PCB. The main uses …

[vol.14] January 2022 Weiterlesen »

[vol.13] October 2021

Multi-Lines Verification 1.Veriworks A program for 2nd judgement of defects identified by the inspection machine, handled by an operator. Judgement by the operator, through a comparison between NG image and known good image. Can be linked with an MES system Inspection machine : Xceed, Xceed BSI, Xceed MICRO (1) Main viewer : showing Good image …

[vol.13] October 2021 Weiterlesen »

[vol.12] July 2021

  AI Auto Teaching 1.AI Auto Teaching Customers introducing AOI inspection to their facility will spend a lot of time building their initial component library. Also, depending on the extent of the developed components library, the time required for teaching new models also varies. It takes about 1 to 2 hours for an experienced person to teach all the parts of a new model, and longer time …

[vol.12] July 2021 Weiterlesen »

[vol.11] April 2021

  Solder Bump Inspection 1.Solder Bump Inspection Solder bump is a conductive bump that connects a chip or die to a PCB or substrate. If a solder bump is defective, this can produce a defect in the product due to the inability for the bump to electrically connect between chip and substrate. A reliable 3D …

[vol.11] April 2021 Weiterlesen »

[vol.10] January 2021

💌 HAPPY NEW YEAR! 2020 is the year we started publishing PARMI newsletter. From the first newsletter in April to December 2020, we introduced PARMI’s technology with 9 newsletters. Fortunately, we could receive many inquiries thanks to writing the newsletters, and we could listen more to customer needs and complaints. Thank you for being with the PARMI …

[vol.10] January 2021 Weiterlesen »

[vol.9] December 2020

  Inspection of Lead Lift of IC in Tray 1.Lead Lift of IC (Integrated Circuit) Components Among the SMT devices, IC components such as QFP (Quad Flat Package) and SOP (Small Outline Package) that are stored in the tray can experience lift and warpage of lead during the copy process due to raw material defects, …

[vol.9] December 2020 Weiterlesen »

[vol.8] November 2020

Chip Component Teaching Automation 1.What is Component Teaching? Since the launch of our Xceed 3D AOI machine in 2014, PARMI has been improving our programming SW consistently for user convenience. Component teaching is important because it forms the basis for accurate component inspection results, but many users find it time-consuming. Generally, the component teaching is …

[vol.8] November 2020 Weiterlesen »

[vol.7] October 2020

The Inspection of the Component Surface -Crack, Warpage 1. Background of Introduction If cracks occur on the surface of an SMT device, it will typically be inspected using 2D data. But according to the color of the device surface, there are limits to inspecting defects only with 2D data because of low discrimination. To overcome …

[vol.7] October 2020 Weiterlesen »