Newsletter

[vol.7] October 2020

  The Inspection of the Component Surface -Crack, Warpage 1. Background of Introduction If cracks occur on the surface of an SMT device, it will typically be inspected using 2D data. But according to the color of the device surface, there are limits to inspecting defects only with 2D data because of low discrimination. To …

[vol.7] October 2020 Weiterlesen »

[vol.6] September 2020

AI OCR Text Inspection 1. What is AI OCR Text Inspection? Text inspection is the most basic and important inspection item when inspecting components of AOI, but false calls occur frequently. PARMI has developed a text inspection method using a deep learning technology (hereinafter “AI OCR”) to increase text recognition rates and reduce false call …

[vol.6] September 2020 Weiterlesen »

[vol.5] August 2020

PCB Warpage Measurement 1. What is “PCB Warpage Measurement”? PARMI provides a function to measure the warpage of PCB’s during the solder paste inspection (SPI) and automated optical inspection (AOI) processes. PCB warpage occurs in the process of fabricating PCB’s or in the SMT manufacturing process. It is important to detect PCB warpage in the …

[vol.5] August 2020 Weiterlesen »

[vol.4] July 2020

On-the-fly Debugging 1. What is “On-the-fly Debugging”? Sometimes, there are occasions that inline inspections should be stopped for debugging. Since this has a significant impact on the production yield rate, PARMI supports on-the-fly debugging. On-the-fly debugging is a function that debugging in Lane 1 of dual-lane machines does not affect Lane 2 in which the …

[vol.4] July 2020 Weiterlesen »

[vol.3] June 2020

Backup Pin 1. What is “Backup Pin”? Through the process of manufacturing, clamping, reflow, PCB can have faulty warpage. The backup pin is a special function that compensates the warpage by installing it at the bottom side of the panel. It is used when real-time Z-axis tracking is out of its limit [10mm(±5mm)]. The PCB …

[vol.3] June 2020 Weiterlesen »

[vol.2] May 2020

Gap & Pin Inspection of Junction Block 1. Background of introduction K company that sells automotive parts, recently introduced PARMI’s Xceed(3D AOI) for “Gap Inspection of Junction Block”. The reasons why Xceed was selected are as follows. First, it makes possible to inspect accurately with high quality 3D data. Junction block gap inspection is known …

[vol.2] May 2020 Weiterlesen »

[vol.1] April 2020

PARMI NEWSLETTER PARMI provides an optimal solution for efficient operation of the process to all customers. As part of this, from April 2020, a monthly newsletter will be issued in order to provide a variety of useful information. We will deliver news about PARMI’s new technology, software update, new machine line-up, and various events every …

[vol.1] April 2020 Weiterlesen »