[Show Name] JPCA SHOW2023
[Dates] May 31st (Wed) – June 2nd (Fri) 10:00–17:00
[Venue] Tokyo Big Sight, Japan
[Organizer] Japan Electronics Packaging and Circuits Association (JPCA)
[Booth Number] East Hall 4B-15

• Xceed : 3D AOI (Automatic Optical Inspection)
• Xceed MICRO : 3D AOI for semiconductor packaging
• Xceed DSI : Double Side Inspection 3D AOI
• PCI 100 DSI : 3D AOI for Conformal Coating Inspection (Double Side Inspection 3D AOI)
• SmartON : PARMI 3D SPI(SigmaX) – 3D AOI(Xceed) Integrated Management Solution