Solder Bump Inspection 1.Solder Bump Inspection Solder bump is a conductive bump that connects a chip or die to a PCB or substrate. If a solder bump is defective, this can produce a defect in the product due to the inability for the bump to electrically connect between chip and substrate. A reliable 3D …
💌 HAPPY NEW YEAR! 2020 is the year we started publishing PARMI newsletter. From the first newsletter in April to December 2020, we introduced PARMI’s technology with 9 newsletters. Fortunately, we could receive many inquiries thanks to writing the newsletters, and we could listen more to customer needs and complaints. Thank you for being with the PARMI …
Inspection of Lead Lift of IC in Tray 1.Lead Lift of IC (Integrated Circuit) Components Among the SMT devices, IC components such as QFP (Quad Flat Package) and SOP (Small Outline Package) that are stored in the tray can experience lift and warpage of lead during the copy process due to raw material defects, …
Chip Component Teaching Automation 1.What is Component Teaching? Since the launch of our Xceed 3D AOI machine in 2014, PARMI has been improving our programming SW consistently for user convenience. Component teaching is important because it forms the basis for accurate component inspection results, but many users find it time-consuming. Generally, the component teaching is …
The Inspection of the Component Surface -Crack, Warpage 1. Background of Introduction If cracks occur on the surface of an SMT device, it will typically be inspected using 2D data. But according to the color of the device surface, there are limits to inspecting defects only with 2D data because of low discrimination. To overcome …
AI OCR Text Inspection 1. What is AI OCR Text Inspection? Text inspection is the most basic and important inspection item when inspecting components of AOI, but false calls occur frequently. PARMI has developed a text inspection method using a deep learning technology (hereinafter “AI OCR”) to increase text recognition rates and reduce false …
PCB Warpage Measurement 1. What is “PCB Warpage Measurement”? PARMI provides a function to measure the warpage of PCB’s during the solder paste inspection (SPI) and automated optical inspection (AOI) processes. PCB warpage occurs in the process of fabricating PCB’s or in the SMT manufacturing process. It is important to detect PCB warpage in the …
On-the-fly Debugging 1. What is “On-the-fly Debugging”? Sometimes, there are occasions that inline inspections should be stopped for debugging. Since this has a significant impact on the production yield rate, PARMI supports on-the-fly debugging. On-the-fly debugging is a function that debugging in Lane 1 of dual-lane machines does not affect Lane 2 in which the …
Backup Pin 1. What is “Backup Pin”? Through the process of manufacturing, clamping, reflow, PCB can have faulty warpage. The backup pin is a special function that compensates the warpage by installing it at the bottom side of the panel. It is used when real-time Z-axis tracking is out of its limit [10mm(±5mm)]. The PCB …
Gap & Pin Inspection of Junction Block 1. Background of introduction K company that sells automotive parts, recently introduced PARMI’s Xceed(3D AOI) for “Gap Inspection of Junction Block”. The reasons why Xceed was selected are as follows. First, it makes possible to inspect accurately with high quality 3D data. Junction block gap inspection is known …
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