PARMI to Exhibit at IPC APEX EXPO 2019

[Show Name] IPC APEX EXPO 2019
[Dates] January 29(Tue)-31(Thu),2019 09:00-18:00
[Venue] San Diego Convention Center, USA
[Organizer] IPC – Association Connecting Electronics Industries®
[PARMI USA Booth Number] 1307

PARMI Co., Ltd. is going to participate in the ‘IPC APEX EXPO 2019’, the largest event for electronics manufacturing in North America attracting more than 9,000 professionals from 45 countries. IPC APEX EXPO is a showcase of exemplary education and networking opportunities as professionals around the world in the printed circuit board and electronics manufacturing industry gather to participate in the technical conference, exhibition, and professional development, standards development and certification programs.

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor), and Xceed BSI(3D AOI for Bottom Side Inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

PARMI’s booth will be located at 1307.