PARMI to Exhibit at smtconnect 2023

[Show Name] smtconnect 2023
[Dates] May 09(Tue)-11(Thu), 2023 09:00–17:00
[Venue] NürnbergMesse, Germany
[Organizer] Mesago Messe Frankfurt GmbH
[Booth Number] Hall 4, Stand 107

PARMI is going to participate in the ‘smtconnect 2023’, Europe’s leading exhibition on solutions for electronic assemblies and systems. In order to show the reliability and accuracy of the machine, PARMI will exhibit the following list of machines and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

  • INTELLION : Next generation 3D AOI
  • SigmaX : 3D SPI (Solder Pasted Inspection)
  • Xceed : 3D AOI (Automatic Optical Inspection)
  • Xceed MICRO : 3D AOI for semiconductor packaging
  • Xceed BSI : Bottom side inspector optimized for wave soldering & pin inspection
  • Xceed DSI : Double side inspection 3D AOI
  • PCI 100 : 3D AOI for conformal coating inspection (Option : coating thickness measurement)

PARMI’s booth will be located at Hall 4-107.