PARMI to Exhibit at JPCA SHOW 2019

[Show Name] JPCA SHOW 2019-The Total Solution Exhibition for Electronic Equipment
[Dates] June 05(Wed)-07(Fri), 2019 10:00-17:00 (16:00 on Friday)
[Venue] Tokyo Big Sight West Hall 1-4, Japan
[Organizer] Japan Electronics Packaging and Circuits Association
[PARMI Japan Booth Number] 1-302

PARMI Co., Ltd. is going to participate in the ‘JPCA SHOW 2019’, comprehensive exhibition of technology embodying IoT, automobile, robots, medical care, wearable, etc.

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor) and Xceed BSI(3D AOI for Bottom Side Inspection), PCI 100(2D/3D conformal coating inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

PARMI’s booth will be located at 1-302.