[Show Name]  SMT/PCB & NEPCON KOREA 2019
[Dates] May 15(Wed)-17(Fri), 2019 10:00-17:00 (16:30 on Friday)
[Venue] COEX convention center Grand Ball Room, KOREA
[Organizer] Reed K. Fairs Ltd.
[PARMI Booth Number] C105

PARMI Co., Ltd. is going to participate in the ‘SMT/PCB & NEPCON KOREA 2019’, Asia’s leading exhibition featuring all kinds of equipment, materials and technologies for electronics manufacturing and SMT.

In order to show the reliability and accuracy of the machine, PARMI will exhibit SIGMAX(3D SPI) and Xceed(3D AOI), Xceed MICRO(3D AOI for Semiconductor) and Xceed BSI(3D AOI for Bottom Side Inspection), PCI 100(2D/3D conformal coating inspection) and demonstrate excellent technology to its customers by operating its equipment directly on the spot.

PARMI’s booth will be located at.